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NTTFS4823N
Power MOSFET
30 V, 50 A, Single N ? Channel, m 8FL
Features
? Small Footprint (3.3 x 3.3 mm) for Compact Design
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? DC ? DC Converters
? High Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
10.5 m W @ 10 V
17.5 m W @ 4.5 V
N ? Channel MOSFET
D (5 ? 8)
I D MAX
50 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
Continuous Drain
Current R q JA (Note 1)
Power Dissipation R q JA
(Note 1)
Continuous Drain
Current R q JA ≤ 10 s
(Note 1)
Power Dissipation
R q JA ≤ 10 s (Note 1)
Continuous Drain
Current R q JA (Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
V GS
I D
P D
I D
P D
I D
± 20
12.6
9.1
2.1
17.5
12.6
4.0
7.1
5.1
V
A
W
A
W
A
G (4)
1
WDFN8
( m 8FL)
CASE 511AB
FLAT LEAD
4823
S (1,2,3)
MARKING DIAGRAM
1
S D
S 4823 D
S AYWW G D
G G D
= Specific Device Code
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC (Note 1)
Power Dissipation
R q JC (Note 1)
Pulsed Drain Current
T C = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
T A = 25 ° C, t p = 10 m s
P D
I D
P D
I DM
0.66
50
36
32.9
150
W
A
W
A
A = Assembly Location
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse Drain ? to ? Source Avalanche Energy
(T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L = 25 A pk , L = 0.1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J ,
T stg
I S
dV/dt
E AS
T L
? 55 to
+150
33
6
31
260
° C
A
V/ns
mJ
° C
Device Package Shipping ?
NTTFS4823NTAG WDFN8 1500/Tape & Reel
(Pb ? Free)
NTTFS4823NTWG WDFN8 5000/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2011
November, 2011 ? Rev. 4
1
Publication Order Number:
NTTFS4823N/D
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